标准号
Item |
中文名
Details |
英文名
Details |
版本/语言
Ver/Language |
样本文件
Preview |
样本 |
eBay |
|
IPC-A-610G ★★ |
电子组件的可接受性 |
Acceptability of Electronic Assemblies |
G |
中文
English |
 |
下载 |
Download |
|
IPC-A-600J ★★ |
印制板的可接受性 |
Acceptability of Printed Boards |
J |
中文
English |
|
下载 |
Download |
|
IPC/WHMA-A-620C★★ |
线缆线束的设计及关键工艺要求、验收 |
Requirements and Acceptance for Cable and
Wire Harness Assemblies |
C |
中文
English
French
(Français) |
|
下载 |
Download |
|
IPC-7711/21C ★★ |
电子组件的返工返修 |
Rework, Modification and Repair of
Electronic Assemblies |
C |
English
中文 |
|
下载 |
Download |
|
IPC J-STD-001G★★ |
焊接的电气和电子组件要求 |
Requirements for Soldered Electrical and
Electronic Assemblies |
G |
中文
English |
|
下载 |
Download |
|
IPC J-STD-002E ★ |
元器件引线、端子、焊片、接线柱及导线的可焊性测试 |
Solder Ability Tests for Component
Leads,Terminations,Lugs,Terminals and Wires |
E |
中文
English |
|
下载 |
Download |
|
IPC J-STD-003C ★ |
印制板可焊性测试 |
Solder Ability Tests for Printed Boards |
C |
中文
English |
|
下载 |
Download |
|
IPC J-STD-004B ★ |
助焊剂要求 |
Requirements for Soldering Fluxes |
B+ |
中文
English |
|
下载 |
Download |
|
IPC J-STD-005A ★ |
焊膏要求 |
Requirements for Soldering Pastes |
A |
中文
English |
|
下载 |
Download |
|
IPC J-STD-006C |
电子焊接领域电子级焊料合金及含有助焊剂与不含助焊剂的固体焊料的要求 |
Requirements for Electronic Grade Solder
Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering
Applications |
C |
中文
English |
|
下载 |
Download |
|
IPC J-STD-020E |
非密封型固态表面贴装组件的湿度回流焊敏感性分类 |
Moisture/Reflow Sensitivity
Classification for Nonhermetic Surface Mount Devices |
E
D.1 |
English
中文 |
|
下载 |
Download |
|
IPC J-STD-030 |
板级底部填充材料的选择与应用 |
JOINT INDUSTRY STANDARD Selection and
Application of Board Level Underfill Materials |
A |
English |
|
下载 |
Download |
|
IPC J-STD-033D |
对湿度、回流焊敏感的表面贴装器件的处置、包装、发运及使用方法 |
Handling,Packing,Shipping
and Use of Moisture, Reflow
and Process Sensitive Devices |
C
D |
中文
English |
|
下载 |
Download |
|
IPC J-STD-035 |
非气密封装电子元件声学显微镜 |
Acoustic Microscopy for Nonhermetic
Encapsulated Electronic Components |
1999 |
English |
|
下载 |
Download |
|
IPC J-STD-075 |
组装工艺中非IC电子元器件的分级 针对组装工艺的非IC电子元件分类 |
Classification of Non-IC Electronic Components
for Assembly Processes |
2008 |
English |
|
下载 |
Download |
|
IPC J-STD-609B |
元器件、印制电路板和印制电路板组件的有铅、无铅及其它属性的标记和标签 |
Marking,Symbols,and Labels of Leaded and
Lead-Free Terminal Finished Materials Used in Electronic Assembly |
A
B |
中文
English |
|
下载 |
Download |
|
IPC-0040 |
光电子组装和封装技术 |
Optoelectronics Assembly and Packaging
Technology |
2003 |
ENGLISH |
|
下载 |
Download |
IPC-1072
Supersede by IPC-1791 |
电子组装制造知识产权保护 |
Intellectual Property Protection in
Electronic Assembly Manufacturing |
2017 |
English |
|
下载 |
Download |
|
IPC-1401 |
供应链社会责任管理体系指南 |
Material Declaration Handbook (for Users
and Manufacturers of Printed Circuit Boards) |
2004 |
English |
|
下载 |
Download |
|
IPC-1601 |
印制板操作和贮存指南 |
Printed Board Handling and Storage
Guidelines |
2010.8
A |
中文
ENGLISH |
|
下载 |
Download |
|
IPC-1710 |
印刷电线板原始制造商资质认证手册 |
OEM Standard for Printed Board
Manufacturers' Qualification Profile |
A |
English |
|
下载 |
Download |
|
IPC-1720A |
组装资格认证纲要 |
Assembly Qualification Profile
|
A |
English
中文 |
|
下载 |
Download |
|
IPC-1751 |
声明流程管理的通用要求 |
Generic Requirements for Declaration
Process Managment |
A |
English |
|
下载 |
Download |
|
IPC-1752 |
材料声明管理 |
Materials Declareation Mangaement |
A |
English |
|
下载 |
Download |
|
IPC-1755 |
冲突矿物数据交换标准 |
Conflict Minerals Data Exchange Standard |
|
English |
|
下载 |
Download |
|
IPC-1756 |
生产工艺数据管理 |
Manufacturing Process Data Mangement |
2010 |
English |
|
下载 |
Download |
|
IPC-1782 |
电子产品可追踪性制造和供应链标准 |
Standard for Manufacturing and Supply
Chain Traceability of Electronic Products |
2016 |
English |
|
下载 |
Download |
|
IPC-1791 |
可资信电子设计师、制造商和组装商要求 |
Trusted Electronic Designer,
Fabricator and Assembler
Requirements |
2018 |
English |
|
下载 |
Download |
|
IPC-2141 |
阻抗受控高速电路板设计指南 |
Design Guide for High-Speed Controlled
Impedance Circuit Boards |
A |
English |
|
下载 |
Download |
|
IPC-2152 |
印刷板设计中载流能力的测定标准 |
Standard for Determining Current Carrying
Capacity in Printed Board Design |
2009 |
English
GERMAN |
|
下载 |
Download |
|
IPC-2221B |
印制版设计通用标准 |
Generic Standard on Printed
Board Design
|
A
B |
中文
English |
|
下载 |
Download |
|
IPC-2222A |
刚性有机印制板设计分标准 |
Sectional Design Standard for Rigid Organic Printed
Boards
|
A |
中文
English |
|
下载 |
Download |
|
IPC-2223D |
挠性印制板设计分标准 |
Sectional Design Standard for Flexible Printed Boards |
C
D |
中文
English |
|
下载 |
Download |
|
IPC-2224 |
PC卡用印制电路板分设计分标准 |
Sectional Standard for Design of PWBs for
PC Cards |
98 |
English |
|
下载 |
Download |
|
IPC-2225 |
有机多芯片模块(MCM-L)和MCM-L
组件设计分标准 |
Sectional Desingn Standard for Organic
Multichip Modules (MCM-L) and MCM-L Assemblies |
98 |
English |
|
下载 |
Download |
|
IPC-2226 |
高密度互连(HDI)印制板设计分标准 |
Sectional Desing Standard for High
Densityh Interconnect (HDI) Printed Boards |
2003 |
English |
|
下载 |
Download |
|
IPC-2251 |
高速电子电路包装的设计指南,取代IPC-D-317A-317A |
Design Guide for the Packaging of High
Speed Electronic Circuits |
2003 |
English |
|
下载 |
Download |
|
IPC-2252 |
射频/微波电路板设计指南 |
Design Guide for RF/Microwave Circuit
Boards |
2002 |
中文
English |
|
下载 |
Download |
|
IPC-2291 |
IPC/JPCA印刷电子设计指南 |
Design Guideline for Printed Electronics |
|
English |
|
下载 |
Download |
|
IPC-2315 |
高密度互连(HDI)和微通孔设计指南 |
Design Guide for High Density
Interconnects (HDI) and Microvias |
2000 |
English |
|
下载 |
Download |
|
IPC-2501 |
基于网络的交换xml数据(信息经纪人)定义 |
Definition for Web-Based Exchange of XML
Data (Message Broker) |
2003 |
English |
|
下载 |
Download |
|
IPC-2511 |
产品生产描述数据和传送方法实现的一般要求 |
Generic Requirements for Implementation
of Product Manufacturing Description Data and Transfer XML
Schema Methodology. |
B |
English |
|
下载 |
Download |
|
IPC-2546 |
专用印制电路板组装设备的分要求 |
Sectional Requirements for Shop-Floor
Equipment Communication Messages (CAMX) for Printed Circuit Board
Assembly |
2003 |
English |
|
下载 |
Download |
|
IPC-2581 |
印制板组件产品制造描述数据和传输方法通用要求 |
Generic Requirements for Printed Board
Assembly Products Manufacturing Description Data and Transfer
Methodology |
B |
English |
|
下载 |
Download |
|
IPC-2612 |
电子图表文件的子标准要求(图解和逻辑说明) |
Sectional Requirements for Electronic
Diagramming Documentation (Schenmatic and Logic Descriptions) |
2010 |
English |
|
下载 |
Download |
|
IPC-4101E |
刚性及多层印制板用基材规范 |
Specification for Base
Materials for Rigid and
Multilayer Printed Boards |
E |
English
中文 |
|
下载 |
Download |
|
IPC-4103 |
高速/高频应用基材规范 |
SPECIFICATION FOR BASE MATERIALS FOR HIGH
SPEED/HIGH FREQUENCY APPLICATIONS |
B |
English |
|
下载 |
Download |
|
IPC-4104 |
IPC/JPCA高密度互连(HDI)和微型导通
孔材料规范 |
Specification for High Density
Interconnect (HDI) and Microvia Materials |
1999 |
English |
|
下载 |
Download |
|
IPC-4121 |
为多层印制电路板应用选择核心建筑的指南,取代IPC-CC-110A |
Guidelines for Selecting Core
Constructions for Multilayer Printed Wiring Board Application |
2000 |
English |
|
下载 |
Download |
|
IPC-4202B |
挠性印制电路用挠性基底介质 |
Flexible Base Dielectrics for Use in
Flexible Printed Boards |
A
B |
中文
English |
|
下载 |
Download |
|
IPC-4203B |
用于挠性印制电路的覆盖和粘合材料 |
COVER AND BONDING MATERIAL FOR FLEXIBLE
PRINTED CIRCUITRY |
B |
English |
|
下载 |
Download |
|
IPC-4204B |
挠性印制电路用挠性覆金属箔介质材料 |
Flexible Metal-Clad Dielectrics for Use
in Fabrication of Flexible Printed Bords |
B
A |
English
中文 |
|
下载 |
Download |
|
IPC-4412B |
印制板用处理“E”玻璃纤维布规范 |
Specification for Finished
Fabric Woven from "E"
Glass for Printed Boards |
2001
B |
English
中文 |
|
下载 |
Download |
|
IPC-4552 |
印制板化学镍/浸金(ENIG)镀层规范 |
Specifiaction for Electroless
Nickel/Immersion Gold (ENIG)Plating for Printed Circuit Boards |
A2017 |
English |
|
下载 |
Download |
|
IPC-4553 |
印制板浸银规范 |
Specification for Immersion
Silver Plating for Printe
d Boards |
A |
English
中文 |
|
下载 |
Download |
|
IPC-4554 |
印制板浸锡规范 |
Specification for Immersion
Tin Plating for Printed
Circuit Boards |
2012 |
中文
English |
|
下载 |
Download |
|
IPC-4556 |
印制板化学镍/化学钯/浸金(ENEPIG)
镀层规范 |
Specification for Electroless
Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed
Circuit Boards |
2016 |
English |
|
下载 |
Download |
|
IPC-4562A |
印制板用金属箔 |
Metal Foil for Printed Board
Applications |
2000 |
中文,
English |
|
下载 |
Download |
|
IPC-4591 |
IPC/JPCA印刷电子功能导电材料要求 |
Requirements for Printed Electronics
Functional Conductive Materials |
2012 |
English |
|
下载 |
Download |
|
IPC-4761 |
设计指南保护印制板孔结构 |
Design Guide for Protectionof Printed
Board Via Structures |
2006 |
English |
|
下载 |
Download |
|
IPC-4921 |
IPC/JPCA印刷电子基材(基板)要求 |
Requirements for Printed Electronics Base
Materials |
2012 |
English |
|
下载 |
Download |
|
IPC-6011 |
印制板通用性能规范 |
Generic Performance Specification for
Printed Boards |
1996 |
English |
|
下载 |
Download |
|
IPC-6012D |
刚性印制板鉴定与性能规范 |
Qualification and Performance
Specification for Rigid Printed Boards |
D |
中文
English |
|
下载 |
Download |
|
IPC-6012DA |
刚性印制板鉴定与性能规范汽车要求附件 |
Automotive Applications Addendum to IPC-6012D Qualification and
Performance Specification for Rigid Printed
Boards |
D |
中文
English |
|
下载 |
Download |
|
IPC-6012DS |
刚性印制板鉴定与性能规范航天和军事航空电子应用补充标准 |
Space and Military Avionics Applications Addendum to
IPC-6012D Qualification and Performance Specification for Rigid Printed
Boards |
D |
中文 |
|
下载 |
Download |
|
IPC-6013D |
挠性印制板的鉴定及性能规范 |
Qualification and Performance
Specification for Flexible/Rigid-Flexible Printed Boards |
B
D |
中文
English |
|
下载 |
Download |
|
IPC-6015 |
有机多芯片模块(MCM-L)安装与互连
结构鉴定与性能规范 |
Qualification & Performance Specification
for Organic Multichip Module Mounting and Interconnecting Structures |
98 |
English |
|
下载 |
Download |
|
IPC-6016 |
高密互连板的资格认证及检验规范 |
Qualification and Performance
Specification for High Density Interconnect (HDI) Layers or Boards |
1999 |
English
中文 译 |
|
下载 |
Download |
|
IPC-6017 |
含埋置无源元件印制板的鉴定与性能规范 |
Qualification and Performance
Specification for Printed Boards Containing Embedded Passive Devices |
2009 |
English |
|
下载 |
Download |
|
IPC-6018C |
高频(微波)印制板鉴定与性能规范 |
Qualification and Performance
Specification for High Frequency (Microwave) Printed Boards |
C
B |
English
中文 |
|
下载 |
Download |
|
IPC-7092 |
埋入式元器件的设计与组装工艺实施 |
Design and Assembly Process
Implementation for Embedded components |
2015 |
English |
|
下载 |
Download |
|
IPC-7093 |
底部端子元器件(BTC)设计和组装工艺的实施 |
Design and Assembly Process
Implementation for Bottom Termination Components |
2011 |
中文
English |
|
下载 |
Download |
|
IPC-7094 |
倒装芯片及芯片级元器件的设计及组装
工艺实施 |
Design and Assembly Process
Implementation for Flip Chip and Die Size Components |
2009 |
English |
|
下载 |
Download |
|
IPC-7095D |
BGA设计及组装工艺实施 |
Design and Assembly Process
Implementation for BGAs |
D
C |
English
中文 |
|
下载 |
Download |
|
IPC-7251 |
PCB板通孔焊盘制作标准 |
IPC 7251-2008 Generic Requirements for
Through-Hole Design and Land Pattern Standard |
2008 |
English |
|
下载 |
Download |
|
IPC-7351 |
表贴元件焊盘设计规范.pd |
Generic Requirements for Surface Mount
Design and Land Pattern Standard |
B |
English |
|
下载 |
Download |
|
IPC-7525B |
模板设计指导 |
Stencil Design Guidelines |
B |
English
中文 |
|
下载 |
Download |
|
IPC-7526 |
模板和错印板的清洗手册 |
Stencil and Misprinted Board Cleaning
Handbook |
2007 |
English |
|
下载 |
Download |
|
IPC-7527 |
焊膏印刷要求 |
Requirements for Solder Paste Printing |
2012 |
English
中文 |
|
下载 |
Download |
|
IPC-7530 |
波峰焊回流焊接工艺温度曲线指南 |
Guidelines for Temperature Profiling for
Mass Soldering Processes (Reflow and Wave) |
2001 |
English |
|
下载 |
Download |
|
IPC-7535 |
锡渣还原化学要求 |
Requirements for Solder Dross Reduction
Chemicals |
2016 |
English
中文 |
|
下载 |
Download |
|
IPC-7801 |
再流焊炉工艺控制标准 |
Reflow Oven Process Control Standard |
2015 |
中文
English |
|
下载 |
Download |
|
IPC-7912 |
DPMO的计算与印制板装配的制造指标 |
Caluculation of DPMO and Manufacturing
Indices for Printed Board Assemblies |
A |
ENGLISH |
|
下载 |
Download |
|
IPC-9121 |
印制板制造工艺疑难解答 |
TROUBLESHOOTING FOR PBC FABRICATION
PROCESSES |
2016 |
中文
English |
|
下载 |
Download |
|
IPC-9151 |
印制板制程能力、品质以及相应可靠性(PCQR2)基准测试标准和数据库 |
Process Capability, Quality, and Relative
Reliability (PCQR2) Benchmark Test Standard and Database |
D |
English |
|
下载 |
Download |
|
IPC-9201 |
表面绝缘电阻手册 |
Surface Insulation Resistance Handbook |
1996 |
English |
|
下载 |
Download |
|
IPC-9204 |
印刷电子的挠性和拉伸性测试指南 |
Guideline on Flexibility and
Stretchability Testing for Printed Electronics |
2017 |
English |
|
下载 |
Download |
|
IPC-9252A |
未组装印制板电气测试要求 |
Surface Insulation Resistance Handbook |
A |
中文 |
|
下载 |
Download |
|
IPC-9261 |
为PCAs的DPMO过程和估计产量 |
In-Process DPMO and Estimated Yield for
PCAs |
A |
English |
|
下载 |
Download |
|
IPC-9262 |
组装行业应用之AOI设备的特性描述与鉴定 |
Specification for Characterization and
Verification of Assembly Level Automatic Optical Inspection Equipment |
2016 |
中文 |
|
下载 |
Download |
|
IPC-9591 |
空气动装置性能参数(如机械,电气,环境和质量/可靠性) |
Performance Parameters
(Mechanical, Electrical,
Environmental and
Quality/Reliability) for
Air Moving Devices |
2006 |
English |
|
下载 |
Download |
|
IPC-9592 |
计算机和通信行业用电源转换设备的
要求 |
Requirements for Power Conversion Devices
for the Computer and Telecommunications Industries |
B |
English |
|
下载 |
Download |
|
IPC-9641 |
高温印刷电路板平整度指南 |
High Temperature Printed Board Flatness Guideline |
2013 |
English |
|
下载 |
Download |
|
IPC-9691 |
IPC-TM-650 测试方法2.6.25 耐导电阳极丝(CAF)测试（电化学迁移测试）用户指南 |
User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing) |
B
A |
English
中文 |
|
下载 |
Download |
|
IPC-9701A |
表面贴装焊接连接的性能测试方法及鉴定要求 |
Performance Test Methods and Qualification Requirements for Surface Mount
Solder Attachments |
A |
English
中文 |
|
下载 |
Download |
|
IPC-9702 |
板极互连的单向弯曲特性描述 |
Monotonic Bend Characterization of Board-Level Interconnects |
2004 |
English
中文 |
|
下载 |
Download |
|
IPC-9703 |
焊点可靠性机械冲击试验准则 |
Mechanical Shock Test Guidelines for Solder Joint
Reliability |
2009 |
English |
|
下载 |
Download |
|
IPC-9704A |
印制板应变测试指南 |
Printed Circuit Assembly
Strain Gage Test Guideline |
A |
English
中文 |
|
下载 |
Download |
|
IPC-9708 |
鉴定印制板组件焊盘坑裂的测试方法 |
Test Methods for Characterization of Printed Board Assembly Pad Cratering |
2010 |
English
中文 |
|
下载 |
Download |
|
IPC-9850 |
表面贴装设备性能检测方法 |
Surface Mount Equipment Characterization |
2001 |
English
中文（译） |
|
下载 |
Download |
|
IPC-9851 |
SMEMA标准机械设备接口标准 |
Mechanical Equipment Interface Standard |
A |
English |
|
下载 |
Download |
|
IPC-A-630★★ |
电子产品整机的制造、检验和测试的可
接受性标准 |
Acceptability Standard for Manufacture,
Inspection, and Testing of Electronic Enclosures |
2013 |
中文
English |
|
下载 |
Download |
|
IPC-A-640 |
光纤、光缆和混合线束组件的验收要求 |
Acceptance Requirements for Optical
Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies |
2017 |
English |
|
下载 |
Download |
|
IPC-AJ-820 |
组装与连接手册 |
Assembly and Joining Handbook |
A |
English |
|
下载 |
Download |
|
IPC-CC-110A |
为多层印制电路板应用选择核心建筑的指南 被IPC-4121取代 |
Guidelines for Selecting Core
Constructions for Multilayer Printed Wiring Board Application |
A |
English |
|
下载 |
Download |
|
IPC-CC-830B |
印制线路组件用电气绝缘化合物的鉴定及性能 |
Qualification and Performance of
Electrical Insulating Compound for Printed Wiring Assemblies |
B |
中文
English |
|
下载 |
Download |
|
IPC-CH-65B |
印制板及组件清洗指南 |
Guidelines for Cleaning of Printed Boards and
Assemblies |
B |
中文
English |
|
下载 |
Download |
|
IPC-D-279 |
高可靠表面安装印制板组装件技术设计导则 |
Design Guide for Reliable Surface Mount
Technology Printed Board Assemblies |
1996 |
English |
|
下载 |
Download |
|
IPC-D-371A |
采用高速技术电子封装设计导则 |
|
|
English |
|
下载 |
Download |
|
IPC-HDBK-001★ |
J-STD-001补充手册与指南 |
Handbook and Guide to Supplement
J-STD-001 |
F |
English |
|
下载 |
Download |
|
IPC-HDBK-005 |
焊膏评估指南 |
Guide to Solder Paste Assessment |
2006 |
English |
|
下载 |
Download |
|
IPC-HDBK-610 |
IPC-A-610的手册和指南 |
Handbook and Guide to IPC-A-610 |
2005 |
English |
|
下载 |
Download |
|
IPC-HDBK-620 |
IPC/WHMA-A-620和IPC-D-620手册和指南 |
Handbook and Guide to IPC-D-620 and
IPC/WHMA-A-620 |
2018 |
English |
|
下载 |
Download |
|
IPC-HDBK-630 |
电子产品整机的制造、检验和测试的可
接受性标准手册 |
Guidelines for Design, Manufacture,
Inspection and Testing of Electronic Enclosures |
2014 |
English |
|
下载 |
Download |
|
IPC-HDBK-830 |
敷形涂覆的设计、选择和应用指南 |
Guidelines for Design, Selection and
Application of Conformal Coatings |
2002 |
English |
|
下载 |
Download |
|
IPC-HDBK-840 |
阻焊膜手册 |
Solder Mask Handbook |
2006 |
English |
|
下载 |
Download |
|
IPC-HDBK-850 |
印制板组装灌封材料和封装工艺的设
计、选择和应用指南 |
Guidelines for Design, Selection and
Application of Potting Materials and Encapsulation Processes Used for
Electronics Printed Circuit Board Assembly |
2012 |
English |
|
下载 |
Download |
|
IPC-PE-740A |
印制板制造和组装的故障排除 |
Troubleshooting for Printed Board
Manufacture and Assembly |
A |
English |
|
下载 |
Download |
|
IPC-QE-605A |
印制板质量评价 |
PCB Quality Evaluation
Handbook |
A |
English |
|
下载 |
Download |
|
IPC-S-816 |
表面安装技术过程导则及检验表 |
SMT Process Guideline and Checklist |
1993 |
English |
|
下载 |
Download |
|
IPC-SM-780 |
外部贴装的元件封装和互连重点 |
Component Packaging and Interconnecting
with Emphasis on Suerface Mounting |
1998 |
English |
|
下载 |
Download |
|
IPC-SM-782A |
元件封装制作标准 |
Surface Mount Design and Land Pattern
Standard
Please refer as follow information data. |
A |
English |
|
下载 |
Download |
|
IPC-SM-785 |
表面安装焊接件加速可靠性试验导则 |
Guidelines for Accelerated Reliability
Testing of Surface Mount solder Attachments |
1992 |
English
中文 |
|
下载 |
Download |
|
IPC-SM-817A |
表面贴装用绝缘粘合剂通用规范 |
General Requirements for Dielectric Surface Mount
Adhesives |
A |
English
|
|
下载 |
Download |
|
IPC-SM-840E |
永久性阻焊剂和挠性覆盖材料的鉴定和性能规范 |
Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover
Materials |
C
D |
English
中文 |
|
下载 |
Download |
|
IPC-SPVC-WP-006 |
轮转法测试和分析无铅合金锡、银和铜 |
Round Robin Testing and Analysis Lead-Freee
Alloys |
2003 |
English |
|
下载 |
Download |
|
IPC-T-50 |
电子电路互连与封装术语及定义 |
Terms and Definitions for Interconnecting and Packaging Electronic Circuits |
K |
English |
|
下载 |
Download |
|
IPC-TM-650★ |
测试方法手册 |
TEST METHODS MANUAL |
2005
2018 |
中文
English |
|
下载 |
Download |
|
IPC-DRM-56 |
导线准备与剥线便携手册 |
Wire Preparation & Crimping Desk
Reference Manual |
2002 |
English |
|
下载 |
Download |
|
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