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IPC - IPC Standard - IPC-0040
IPC-0040 :

Optoelectronics Assembly and Packaging Technology

File Format PDF  
Price $35  
Rev 2003    
Language English    
Number of page 176  
Date of Publication 2003  
     
         

This document addresses the implementation of optical and optoelectronic packaging technologies.

The areas discussed include: technology choices, design considerations, material properties, component mounting and interconnecting structures, assembly processes, testing, application, rework, and reliability of completed optoelectronic products. Optoelectronic packaging technologies include active and passive components and discrete fiber cable, their characteristics, and the manner that these parts will become an integral part of the functioning module, board or subassembly.

Purpose

This document is intended to provide general information on implementing optical and optoelectronic packaging technologies, for creating component mounting structures and assemblies that may be exclusively optically oriented or that are to perform a combination of optical and electronic functions.

 
IPC-A-610  IPC-A-600 IPC-A-620 IPC-7711/7721
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