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IPC - IPC Standard - IPC-2223D
IPC-2223D :

Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

File Format PDF  
Price $35  
Rev D C  
Language English Chinese  
Number of page 60  
Date of Publication 2016  
     
         

This standard establishes the specific requirements for the design of flexible and rigid-flexible printed board applications and its forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced, dielectric in combination with metallic materials. These interconnecting boards may contain single, double, multilayer, or multiple conductive layers and can be comprised wholly of flex or a combination of both flex and rigid. 

Purpose 

The requirements contained herein are intended to establish specific design details that shall be used in conjunction with IPC-2221 and may also be used in conjunction with IPC-2222 for the rigid sections of rigid-flex circuits.


 
IPC-A-610  IPC-A-600 IPC-A-620 IPC-7711/7721
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