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IPC - IPC Standard - IPC-2226A
IPC-2226A :

Sectional Design Standard for High Density Interconnect (HDI) Printed Boards

File Format PDF  
Price $35  
Rev A 2003  
Language English    
Number of page 48  
Date of Publication 2017  

This standard establishes requirements and considerations for the design of organic and inorganic high density interconnect (HDI) printed boards and structures for component mounting and interconnections. 

Purpose The requirements contained herein are intended to establish design principles and recommendations that shall be used in conjunction with the detailed requirements of IPC-2221. In addition, when the core material reflects requirements identified in the sectional standards (IPC-2222, IPC-2223, and IPC-2225), that information becomes a mandatory part of this standard. 

The standard provides recommendations for signal, power, ground, and mixed distribution layers, dielectric separation, via formation and metallization requirements and other design features that are necessary for HDI substrates. 


IPC-A-610  IPC-A-600 IPC-A-620 IPC-7711/7721