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IPC - IPC Standard - IPC-4552A
IPC-4552A :

Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

File Format PDF  
Price $35  
Rev A    
Language English    
Number of page 148  
Date of Publication 2017  
     
         
The IPC-4552A performance specification sets requirements for Electroless Nickel/Immersion Gold (ENIG) deposit thicknesses for applications including soldering, wire bonding and as a contact finish. The IPC-4552A is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) and original equipment manufacturers (OEM). The IPC-4552A standard may be used to specify acceptance criteria to meet performance requirements in addition to those found in the IPC-6010-FAM Printed Board Performance Specifications. The ENIG deposit specified by using this document will meet the highest coating durability rating as specified in the J-STD-003 printed board solderability specification. 

The IPC-4552A specification is based on three critical factors:
  • 1. The ENIG plating process is in control producing a normal distribution for nickel and gold deposit thickness.
  • 2. That the tool used to measure the deposit and therefore control the process is accurate and reproducible for the thickness range specified.
  • 3. That the ENIG plating process results in uniform deposit characteristics.

 

 
IPC-A-610  IPC-A-600 IPC-A-620 IPC-7711/7721
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