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IPC - IPC Standard - IPC-7092

Design and Assembly Process Implementation for Embedded components

File Format PDF  
Price $38  
Rev 2015  
Language English    
Number of page 148  
Date of Publication 2015  
This document describes the design and assembly challenges for implementing passive and active components, in either formed or placed methodology, into a printed board. The completed structure including internal electronic components is ready for surface mount and/or through-hole component attachment. The multilayered structure becomes a complete product ready for further processing in an assembly process and can be made from organic, inorganic (ceramic) or both types of material. 
IPC-A-610  IPC-A-600 IPC-A-620 IPC-7711/7721