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IPC - IPC Standard - IPC-7095D

Design and Assembly Process Implementation for Ball Grid arrays(BGAs)


File Format PDF  
Price $35  
Rev D C
Language English   Chinese
Number of page 208 176
Date of Publication 2018 2013

IPC-7095D describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095D provides useful and practical information to those who use or are considering using BGAs. It also provides describes how to successfully implement robust design and assembly processes for printed board assemblies using BGAs as well as ways to troubleshoot some common anomalies which can occur during BGA assembly.

IPC-7095D Download .View table of contents 

IPC-A-610  IPC-A-600 IPC-A-620 IPC-7711/7721