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IPC - IPC Standard - IPC-9502
PWB assembly soldering process guideline for electronic components
File Format PDF  
Rev 1999    
Language English    
Number of page 23  
Date of Publication 1999  

This document describes the manufacturing solder process limits that components subjected to IPC-9501, IPC-9504 and IPC/JEDEC J-STD-020 would survive. It does not include optimum conditions for assembly, but provides guidelines to ensure components are not damaged. This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. This document is intended to complement other industry documents. Note: This document does not address the increased temperature requirements of lead-free solders.


IPC-9502 Download/View table of contents

IPC-A-610  IPC-A-600 IPC-A-620 IPC-7711/7721