Language:    Chinese   English
Free Download 
IPC - IPC Standard - IPC-9702
IPC/JEDEC-9702:

Monotonic Bend Characterization of Board-Level Interconnects

File Format PDF  
Price $35  
Rev    
Language English   Chinese
Number of page 28 28
Date of Publication 2004 2004
     
         

This publication is intended to characterize the frature strength of a component's board level-interconnect by providing a common method of establishing the fracture resistance to flexural loading that may occur during conventional non-cyclic board assembly and test operations. The document is applicable to surface mount components attached to printed wiring boards using conventional solder reflow technologies and supplements existing standards that address mechanical shock or impact during shipping, handling or field operation. Includes the amendment to Section 8.7-Test Board Daisy-Chain Links.

 

IPC-9702 Download/View table of contents


 

 
IPC-A-610  IPC-A-600 IPC-A-620 IPC-7711/7721
E-mail:  cdm_lj@163.com
13958233280@QQ.COM
www.file123.top