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IPC - IPC Standard - IPC-9708
IPC/JEDEC-9708:

Test Methods for Characterization of Printed Board Assembly Pad Cratering

 

File Format PDF  
Price $35  
Rev    
Language English  /Chinese  
Number of page 28  
Date of Publication 2010  
     
         

Mechanical bend and shock tests are routinely performed on SMT assemblies to ensure that they can sustain anticipated production, handling and end use conditions. The strains and strain rates applied to SMT assemblies during bend and shock testing can lead to a variety of failure modes in the vicinity of the solder joints. This document provides test methods to evaluate the susceptibility of printed board assembly (PBA) materials and designs to cohesive dielectric failure underneath surface mount technology (SMT) attach pads. The test methods, which include pin-pull, ball-pull, and ball shear, can be used to rank order and compare different printed board materials and design parameters.

 

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IPC-A-610  IPC-A-600 IPC-A-620 IPC-7711/7721
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