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IPC - IPC Standard - IPC-HDBK-001F

Handbook and Guide to Supplement J-STD-001

File Format PDF  
Price $35  
Rev F  
Language English    
Number of page 140  
Date of Publication 2016  

This Handbook is a companion reference to the J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies (Standard) and is intended to provide supporting information. 

Additional detailed information can be found in documents referenced within the Standard (and this Handbook). Users are encouraged to reference those documents to better understand the applicable subject areas. 

Although this Handbook uses mandatory terminology (e.g., shall, must, etc.), nothing within this Handbook is considered mandatory unless this document is specified as a mandatory requirement in the contract documentation. 

The intent of this Handbook is to capture ‘‘how and why’’ information and give more background for the specification limits and how they were derived. In addition, other supporting information is provided to give a broader understanding of the process considerations needed for the production of acceptable hardware. The target user of this Handbook is a Process or Manufacturing Engineer. 

NOTE: The revision of this Handbook (‘‘F’’) was revised in an attempt to align with the base document/Standard (J-STD- 001 also rev ‘‘F’’). Please check for the latest revision or for any amendment(s) that may include changes that could alter: explanations for how and why, or more detailed discussions on criteria. 

Purpose The Handbook describes materials, methods, and verification criteria that, when applied as recommended or required, will produce quality soldered electrical and electronic assemblies. The intent of the Handbook is to explain the ‘‘how-to,’’ the ‘‘why,’’ and fundamentals for these processes, in addition to implementing control over processes rather than depending on end-item inspection to determine product quality. 

The J-STD-001 and the IPC-HDBK-001 do not exclude any acceptable process used to make the electrical connections, as long as the methods used will produce completed solder joints conforming to the acceptability requirements of the Standard. 



IPC-HDBK-001F Download/View table of contents




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