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IPC - IPC Standard - IPC J-STD-033D
IPC J-STD-033D:

Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

File Format PDF  
Price $35  
Rev D  
Language English  /Chinese(C)  
Number of page 31  
Date of Publication 2018  
     
         
    

IPC/JEDEC J-STD-033D provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. IPC/JEDEC J-STD-033D procedures provide a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC.


IPC J-STD-033D Download/View table of contents


 
IPC-A-610  IPC-A-600 IPC-A-620 IPC-7711/7721
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